Wide range of variations
The most suitable module can be selected to place components from microchips to odd-shaped components, as well as depending on the products and the production volume.
*Heads can be changed after purchase.
Improves actual productivity with lighter high-speed head and new optimization
Lighter high-speed head and new manufacturing sequence optimization has increased productivity by 7 % compared to the former optimization model Ver.4.
New high-flexibility 8 nozzles head Further component handling capability
The generalized Ver.5 (optional) expands existing component range. A wide variety of components, ranging from a 0402 chip to 50mm and a large size connector (100× 50mm),have become mountable.
The 3D sensor and direct tray feeder can be installed as before providing superior handling capabilities for odd-shaped components.
Improves area productivity with compact feeder carts
Increases placement reliability by the 3D sensor
High-quality placement for IC component via the 3D sensor
High-speed detection via batch scanning.
Multifunctional transfer unit supporting POP and C4
Highly versatile unit accurately transfers solder/flux for POP top packaging/C4 mounting on the bump side.
*1:Only for main body
*2:Dimension D including direct tray feeder:2 565 mm
*3:Excluding monitor and signal tower
*4:Standard configuration:excluding batch exchange cart and tray feeders. This may differ depending on configuration.
*5:The 0402 chip requires a specific nozzle/feeder.
*6:When T is more than 11.5mm,special nozzles are needed.Please consult us separately.
*7:When T is more than 21mm,special nozzles are needed.Please consult us separately.
*8:When T is more than 6.5mm,special nozzles are needed.Please consult us separately.
*Values such as maximum speed and placement accuracy may vary depending on operating conditions.
*Please refer to the "Specification" booklet for details.