Continued Evolution of the KE Series

Chip

20,900CPH chip (Laser centering/Optimum)

17,100CPH chip (Laser centering / IPC9850)

IC

9,470CPH (Vision centering/MNVC)

From 0402(01005) to 74mm square components or 50×150mm

KE-3020VA

One multi-nozzle laser head (6 nozzles) plus

one IC head with CDS sensor (1 nozzle)

KE-3020VRA

One multi-nozzle laser head (6 nozzles) plus

one IC head with FMLA sensor (1 nozzle)

The use of electronic double tape feeders enables mounting of a maximum of 160 component types.

MNVC is standard

High-speed, on-the-fly vision centering

(When using both high-resolution camera and MNVC)

High speed feeding of tray components (Option)

Longer sized PWB in X axis(option)

PoP placement(option)

 

www.etasmt.com

 

www.smt11.com

 

www.smt22.com

 

www.smt33.com

 

www.smt44.com

 

www.ledpickandplace.com

 

www.wavesolderingmachine.com

 

www.smtengineer.com