Aluminum substrate production process
From: Author:Mark Hardy Publish time:2021-09-08 11:39 Clicks:0
The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, a single panel is composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer. Very few applications are multi-layer boards, which can be formed by bonding ordinary multi-layer boards with insulating layers and aluminum bases.
LED aluminum substrate is PCB, which is also the meaning of printed circuit board, but the material of the circuit board is aluminum alloy. In the past, the material of our general circuit board was glass fiber, but because the LED heats up, the circuit board used in LED lamps is generally The aluminum substrate can conduct heat quickly, and the circuit boards for other equipment or electrical appliances are still glass fiber boards!
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Compared with the traditional FR-4, the aluminum substrate can minimize the thermal resistance, so that the aluminum substrate has excellent thermal conductivity; compared with the thick film ceramic circuit, its mechanical properties are extremely good.
In addition, aluminum substrates have the following unique advantages:
Meet the requirements of RoHs;
More suitable for SMT process;
Extremely effective treatment of thermal diffusion in the circuit design scheme, thereby reducing the operating temperature of the module, prolonging the service life, and improving the power density and reliability;
Reduce the assembly of heat sinks and other hardware (including thermal interface materials), reduce product volume, and reduce hardware and assembly costs; optimize the combination of power circuits and control circuits;
Replace fragile ceramic substrates to obtain better mechanical durability.
Aluminum base plate (metal base heat sink (including aluminum base plate, copper base plate, iron base plate)) is a low-alloyed Al-Mg-Si series high-plasticity alloy plate (see the figure below for the structure), which has good thermal conductivity and electrical insulation Performance and mechanical processing performance, compared with the traditional FR-4, the aluminum substrate adopts the same thickness and the same line width, the aluminum substrate can carry higher current, the aluminum substrate can withstand voltage up to 4500V, and the thermal conductivity is greater than 2.0. The industry is dominated by aluminum substrates.
●Using surface mount technology (SMT);
●Extremely effective treatment of thermal diffusion in the circuit design scheme;
●Reduce product operating temperature, improve product power density and reliability, and extend product service life;
●Reduce product volume, reduce hardware and assembly costs;
●Replace fragile ceramic substrates to obtain better mechanical durability. structure
Aluminum-based copper clad laminate is a metal circuit board material, composed of copper foil, thermally conductive insulating layer and metal substrate. Its structure is divided into three layers:
Cireuitl.Layer circuit layer: equivalent to the copper clad laminate of an ordinary PCB, the thickness of the circuit copper foil is loz to 10oz.
DielcctricLayer insulating layer: The insulating layer is a layer of low thermal resistance and thermally conductive insulating material. Thickness: 0.003" to 0.006" inches is the core technology of aluminum-based copper clad laminates, which has obtained UL certification.
BaseLayer base layer: is a metal substrate, generally aluminum or copper can be selected. Aluminum-based copper clad laminates and traditional epoxy glass cloth laminates, etc.
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